Specimen Mounting Devices (Cold Curing Models)
Automatic Epoxy Resin Mounting Device Model RAM-1
Fast, accurate resin-filled molding is performed by automatic injection of a liquid resin (two-liquid mixture) into a molding die in which a test piece is set.
■Product Specifications
| Device Configuration | ・Two-liquid mixture cutoff device ・Electrical device ・Front/back conveying table ・Platform |
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| Outer Dimensions(mm) | 3100W×1300D×2050H |
| Weight | Approx. 350kg |
■Features
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Accurate cutoff-injection of a two-liquid mixture (containing proportion-controlled amounts of a base resin and a curing agent that are stirred together uniformly). |
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Cutoff-injection amounts of the two-liquid mixture can be controlled by performing volume calculation of the test pieces on an electronic balance. |
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Identity management is possible. |
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Cut-off injection can be performed in a short time (within 5 minutes/specimen). |
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The molding die size can be changed. |
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The curing time can be shortened by addition of an insulating cover. |
■Cold Mounting Molding Cups
| Product made in Polyacetal resin Aka Mold |
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25Φ、30Φ、40Φ、50Φ(mm) |
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10 pcs. each |
